Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

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The story "Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore" was covered 2 weeks ago by GlobeNewswire, a news publisher based in China.

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GlobeNewswire 2w ago

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore - GlobeNewswire

Quick Summary:

Approximate $7 billion investment over the next several years to meet AI data center demandSINGAPORE, Jan.08, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc.(Nasdaq: MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.

Micron will maintain flexibility in managing the pace of capacity ramps in both the HBM and NAND facilities to align with market demand. Micron’s current facility in Singapore is the first front-end semiconductor fab in the world to be recognized as the Advanced Fourth Industrial Revolution Lighthouse and Sustainability Lighthouse by the World Economic Forum.

"With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead.” Micron’s HBM advanced packaging investment of approximately US $7 billion (SG$9.5 billion) through the end of the decade and beyond will initially create around 1,400 jobs, with site expansion plans to reach an estimated 3,000 jobs in the future.