€1 billion EIB loan will help fuel NXP’s research, development, and innovation (RDI) efforts in Austria, France, Germany, The Netherlands and Romania Loan will accelerate NXP’s RDI aimed at various end markets including automotive, Industrial, and Internet of Things (IoT)Supporting critical EU technology is a key EIB priority as outlined in its strategic roadmap and furthers EIB’s commitment to the EU Chips Act LUXEMBOURG and EINDHOVEN, The Netherlands, Jan.15, 2025 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V.(NASDAQ: NXPI) today announced that it has secured a €1 billion loan from the European Investment Bank (EIB) to advance the company’s RDI investments across its broad portfolio of semiconductor solutions.
As semiconductors are key to the digital and green transitions, their importance will only grow, and the EIB proudly supports such strategic technology.” NXP research and development teams across Europe are focused on creating the next generation of automotive processors, advanced automotive radar solutions, improved energy and driver systems, in-vehicle networking, and secure car access, in addition to other equally important intelligent edge technologies such as artificial intelligence (AI), secure edge identification, Near Field Communication (NFC) wallets for mobile phones and smart wearables, and other devices which improve quality of life and further sustainability efforts.
It is also consistent with our investment in the ESMC joint venture fab currently being built in Germany, which will address Europe’s automotive and industrial chip requirements.” The investment will contribute to building a state-of-the-art European chip ecosystem, in-line with the EU Chips Act, the Dutch Semicon Valley and the National Technology Strategy of the Netherlands’ Government, whose scope is to strengthen the semiconductor market in the EU to ensure a secure and competitive supply of chips.
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